Technology maturity index
Technology with high expected innovation steps
Binder Jetting is still waiting for the wider industrial break through. Although smaller systems from DIGITAL METAL and EXONE are used in first serial production scenarios, the overall installed base of Binder Jetting systems is still very small. However, AMPOWER expects Binder Jetting to quickly rise in the Maturity Index over the next two to three years. Especially the announcements of HP and DESKTOP METAL partnering with major players in the powder metallurgy industry shows, that the bottle neck of the sintering process is targeted and potentially solved soon. The release of large production systems of multiple machine OEMs in 2020 shows, that the target application is beyond the typical PBF part complexity and batch size, but rather trying to cannibalize metal injection molding and powder metallurgy applications.
Binder Jetting still with limited production capacities
Design and applications
Sintering effects cause design restrictions in Binder Jetting
Materials and alloys
Stainless steel standard, many more possible
Binder Jetting comparable to MIM
The material properties of parts fabricated by Binder Jetting in 316L excel compared to the values required for steel bars according to ASTM A276 (Standard Specification for Stainless Steel Bars and Shapes). Typically, the material density is around 99 % and therefore compares to high end MIM applications. The pore size and distribution are mainly depending on the debinding and sintering process applied, but typically results in small round pores below 20 µm in diameter. The microstructure shows twinned austenitic grains with grain sizes between 50 to 100 µm. The printed parts exhibit hardness close to the requirements for MIM alloys defined in ISO 22068. Values for yield strength, ultimate tensile strength and elongation exceed the required properties defined for MIM parts in 316L. Fatigue properties of BJT parts is topic of numerous R&D activities, as there is yet little information available.